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Holistic system-technology co-optimization (STCO) approach key in reducing peak GPU and HBM temperatures under AI workloads while enhancing performance density of future GPU-based architectures
LEUVEN, Belgium, Dec. 9, 2025 /PRNewswire/ —
- Imec presents the first comprehensive thermal study of 3D HBM-on-GPU integration using a system-technology co-optimization (STCO) approach.
- The study allows to identify and mitigate thermal bottlenecks in a promising next-gen compute system architecture for AI applications.
- Peak GPU temperatures could be reduced from 140.7°C to 70.8°C under realistic AI training workloads.
- "This is also the first time that we demonstrate the capabilities of imec’s new cross-technology co-optimization (XTCO) program in developing more thermally robust advanced compute systems." – Julien Ryckaert, imec.
- About imec
Imec is a world-leading research and innovation hub in advanced semiconductor technologies. Leveraging its state-of-the-art R&D infrastructure and the expertise of over 6,500 employees, imec drives innovation in semiconductor and system scaling, artificial intelligence, silicon photonics, connectivity, and sensing.Imec’s advanced research powers breakthroughs across a wide range of industries, including computing, health, automotive, energy, infotainment, industry, agrifood, and security. Through IC-Link, imec guides companies through every step of the chip journey – from initial concept to full-scale manufacturing – delivering customized solutions tailored to meet the most advanced design and production needs.
Imec collaborates with global leaders across the semiconductor value chain, as well as with technology companies, start-ups, academia, and research institutions in Flanders and worldwide. Headquartered in Leuven, Belgium, imec has research facilities in Belgium, across Europe and the USA, and with representation on three continents. In 2024, imec reported revenues of €1.034 billion. For more information, visit www.imec-int.com
Full press release: https://www.imec-int.com/en/press/imec-mitigates-thermal-bottleneck-3d-hbm-gpu-architectures-using-system-technology-co